Thursday, September 11, 2008

Hybrid Designer for PA and Front End Modules- San Jose, CA

Description
Join this team focused on developing leading-edge solutions for 4th Generation Wireless Products. A team consists of a Project Manger, IC designer(s), Hybrid designer(s), and technician(s).

Develop innovative Solutions for Multi-Band and Multi-Mode Front End Modules (FEMs) for the following standards: GSM, EDGE, W-CDMA, LTE, and WiMAX. These modules are designed to be 50 Ohms utilizing a mixture of lumped, distributed, and on chip matching. You will be responsible for the RF design of the module that could utilize FBAR, SAW, E-pHEMT, D-pHEMT, InGaP HBT, BiFET, CMOS, PCB, or LTCC technologies. You will own all design and integration aspects of the module and need to work with the RFIC designers to determine the optimal partitioning of the technologies to be used for this approach. The challenge is to meet or exceed the Cost, Performance, Size, and Schedule constraints for the solution. This process will require a balance of simulation tools such as Agilent’s ADS, the Cadence Suite, Momentum or Ansoft’s HFSS, and hands-on testing and integration work in the lab.

Qualifications
Minimum Requirements:
* Bachelor of Science in Electrical Engineering with an emphasis on RF/Microwaves
* Five years of experience in RF PA design and related fields
* Working knowledge of Semiconductor Technologies used in Power Amplifiers
* Proficient with CAD tools such as ADS, Momentum, HFSS, Cadence Suite
* Ability to work in a fast-paced, project-oriented, team environment
* Demonstrated ability to work independently, and create and meet schedules
* Strong Communication Skills

Desired Requirements:
* Masters of Science in Electrical Engineering with an emphasis on RF/Microwaves
* At least Five years of Analog RF, PA, or FEM Design Experience
* Experience with RF filter design in Single and Multi-Layer Substrates
* At least Five year of PA RFIC design to lead the IC design function
* Experience with Wireless System Design for Cellular or Data Markets
* Hybrid Chip-On-Board Design and Prototyping Experience
* Proficient in use and Programming of RF Test Equipment
* Experience taking a product to Volumes greater than 500k/month